PlantCtrl/board/kicad-stuff/SSOP10.kicad_mod
2023-10-15 13:16:44 +02:00

29 lines
1.9 KiB
Plaintext

(footprint SSOP10 (layer F.Cu) (tedit 652971AF)
(descr "")
(attr smd)
(fp_text reference REF** (at -3.2004 0.0 900) (layer F.SilkS)
(effects (font (size 0.64 0.64) (thickness 0.15)))
)
(fp_text value SSOP10 (at 3.1496 -0.4064 900) (layer F.Fab)
(effects (font (size 0.64 0.64) (thickness 0.15)))
)
(pad 2 smd rect (at -1.0 2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 9 smd rect (at -1.0 -2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 1 smd rect (at -2.0 2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 3 smd rect (at 0.0 2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 4 smd rect (at 1.0 2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 10 smd rect (at -2.0 -2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 8 smd rect (at 0.0 -2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 7 smd rect (at 1.0 -2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 5 smd rect (at 2.0 2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 6 smd rect (at 2.0 -2.8) (size 0.6 1.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(fp_line (start 2.527 -1.9) (end 2.527 1.4) (layer F.Fab) (width 0.2032))
(fp_line (start 2.527 1.4) (end 2.527 1.9) (layer F.Fab) (width 0.2032))
(fp_line (start 2.527 1.9) (end -2.527 1.9) (layer F.Fab) (width 0.2032))
(fp_line (start -2.527 1.9) (end -2.527 1.4) (layer F.Fab) (width 0.2032))
(fp_line (start -2.527 1.4) (end -2.527 -1.9) (layer F.Fab) (width 0.2032))
(fp_line (start -2.527 -1.9) (end 2.527 -1.9) (layer F.Fab) (width 0.2032))
(fp_line (start 2.527 1.4) (end -2.527 1.4) (layer F.Fab) (width 0.2032))
(fp_line (start -1.905 1.016) (end -1.905 -1.016) (layer F.SilkS) (width 0.3048))
)